Micro-patterning of Copper Based on Photolithographed Self-assembly Monolayers

Lan HUANG Li Na XU Hao Ying SHEN Hai Qian ZHANG Ning GU

引用本文: Lan HUANG,  Li Na XU,  Hao Ying SHEN,  Hai Qian ZHANG,  Ning GU. Micro-patterning of Copper Based on Photolithographed Self-assembly Monolayers[J]. Chinese Chemical Letters, 2002, 13(2): 163-164. shu
Citation:  Lan HUANG,  Li Na XU,  Hao Ying SHEN,  Hai Qian ZHANG,  Ning GU. Micro-patterning of Copper Based on Photolithographed Self-assembly Monolayers[J]. Chinese Chemical Letters, 2002, 13(2): 163-164. shu

Micro-patterning of Copper Based on Photolithographed Self-assembly Monolayers

  • 基金项目:

    This work was supported by the National Natural Science Foundation of the People's Republic of China (No.69890220).

摘要: A new method has been developed for fabrication of copper micro-pattern by selective chemical copper deposition based on photolithographed (3-mercaptopropyl)-trimethoxysilane (MPTS) self-assembly monolayers (SAMs).As confirmed by scanning electron microscopy (SEM), Cu closely replicated the mask features.The present approach makes this technic to be cheap and may be applicable to assembly of microelectronic circuits.

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  • 收稿日期:  2001-07-16
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