引用本文:
张丽丽, 宣天鹏, 于瑶, 闵文锦. 活化液中稀土离子Ce3+对铜粉化学法镀银的促进作用[J]. 应用化学,
2010, 27(4): 441-444.
doi:
10.3724/SP.J.1095.2010.90344
Citation: ZHANG Li-Li, XUAN Tian-Peng, YU Yao, MIN Wen-Jin. The Promotion of Ce3+ in the Activation Solution to Electroless Plating of Ag on Cu Powers[J]. Chinese Journal of Applied Chemistry, 2010, 27(4): 441-444. doi: 10.3724/SP.J.1095.2010.90344
Citation: ZHANG Li-Li, XUAN Tian-Peng, YU Yao, MIN Wen-Jin. The Promotion of Ce3+ in the Activation Solution to Electroless Plating of Ag on Cu Powers[J]. Chinese Journal of Applied Chemistry, 2010, 27(4): 441-444. doi: 10.3724/SP.J.1095.2010.90344
活化液中稀土离子Ce3+对铜粉化学法镀银的促进作用
English
The Promotion of Ce3+ in the Activation Solution to Electroless Plating of Ag on Cu Powers
Abstract:
A trace amount of rare earth metal cation,e.g. Ce3+ was added to the activation solutions to enhance the electroless plating of Ag on Cu powder.Polarization curves of activation solutions,micromorphology and the clad ratio of silver on copper powder surface were studied through electrochemistry and scanning electron microscopy.The results show that the Ce3+ added to the Pd2+ activation solutions with an appropriate amount enables the decrease of polarizability,the increase of static potential and plating potential.Therefore,the reaction of activation solution became easier.A suitable amount of rare earth element can increase the deposition speed of silver on copper powder surface.With the further increase of rare earth element content,the particle size of silver plating on copper powder tend to dcrease and the coatings became clease gradually.The optimal addition value of Ce3+ is 0.32 g/L.
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Key words:
- rare earth
- / silver plating copper powder
- / activation
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