Abstract: The photocurable carboxylated epoxy acrylate(CEA) resins were synthesized via the reaction between hydroxyl group on epoxy acrylate resin(EA) and polybasic carboxylic acid anhydride, e.g. maleic anhydride(MAn), phthalic anhydride(PAn), succinic anhydride (SAn), tetrahydrophthalic anhydride(THPAn) and hexahydrophthalic anhydride(HHPAn). The catalyst, such as tetramethyl ammonium bromide, could effectively accelerate the reaction. If one-third of epoxy resin based on CEA was cooperated with CEA resin, the dried films comprised of MAn or PAn modified resin were completely unsoluble in alkaline solution before photocuring, but not for that comprised of SAn, TPAn or HPAn resins. The formulations mixtures containing THPAn or HHPAn resins could be photopolymerized rapidly to a greater extent compared with that containing MAn or PAn resins. The photocured and post-thermal-cured films exhibited satisfactory thermal stability except for that containing PAn resin. THPAn and HHPAn were the appropriate carboxylic anhydride for the preparation of the alkaline developable photosensitive solder resist.