引用本文:
曾兆华, 杨建文, 覃海定, 陈用烈. 碱水显影阻焊油墨研究——羧基与环氧基的反应[J]. 应用化学,
2002, 19(1): 18-21.
Citation: ZENG Zhao-Hua, YANG Jian-Wen, QIN Hai-Ding, CHEN Yong-Lie. Study on Liquid Alkali Developing Type Solder Resists: Reaction Between Dibasic Acid Half-ester with Epoxy Compound[J]. Chinese Journal of Applied Chemistry, 2002, 19(1): 18-21.
Citation: ZENG Zhao-Hua, YANG Jian-Wen, QIN Hai-Ding, CHEN Yong-Lie. Study on Liquid Alkali Developing Type Solder Resists: Reaction Between Dibasic Acid Half-ester with Epoxy Compound[J]. Chinese Journal of Applied Chemistry, 2002, 19(1): 18-21.
碱水显影阻焊油墨研究——羧基与环氧基的反应
摘要:
研究了碱水显影阻焊油墨工艺中所涉及的二元酸单酯与环氧化合物的反应.采用马来酸单甲酯(MAM)、丁二酸单甲酯(SAM)、邻苯二甲酸单甲酯(PAM)、四氢邻苯二甲酸单甲酯(H4PAM)、六氢邻苯二甲酸单甲酯(H6PAM)和苯基缩水甘油醚(PGE)作为模型化合物,考察了各种因素对羧基与环氧基反应的影响.发现二元酸单甲酯的空间位阻越小和酸性越强则反应活性越大;对MAM与PGE的反应,催化剂的催化活性大小为乙酰丙酮铬(CrAA) > 四甲基溴化铵(TMAB)>1-甲基咪唑(MI) > N,N-二甲基苄胺(DMBA);反应活性在非极性的二甲苯溶剂中比在极性的丁基溶纤剂醋酸酯(BCA)溶剂中大;反应在100℃能顺利进行,但在80℃时大多数的反应活性都很低.
English
Study on Liquid Alkali Developing Type Solder Resists: Reaction Between Dibasic Acid Half-ester with Epoxy Compound
Abstract:
Reaction of dibasic acid half-ester with epoxy compound has been investigated as function of factors affecting the reaction between carboxyl groups and epoxy using half-esters of a series of acid:maleic acid(MAM), succinic acid(SAM), phthalic acid(PAM), cis-1,2,3,6-tetrahydrophthalic acid(H4PAM) and cis-hexahydrophthalic acid(H6PAM), and phenyl glycidyl ether(PGE) as model compounds. It was found that higher reactivity would be achieved for the dibasic acid half-esters with smaller molecular size or stronger acidity. In the case of reaction between maleic acid monomethyl eater(MAM) and PGE, the catalytic activity of the catalysts decreased in the order of chromium acetylacetonate (CrAA) > tetramethyl ammonium bromide(TMAB) > 1-methylimidazole(MI) > N,N-dimethyl benzylamine(DMBA). The effects of solvent polarity and temperature on the reaction has also been examined.
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Key words:
- liquid alkali developing
- / solder resist
- / dibasic acid half-ester
- / epoxy
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