Citation: LIU Danfeng, DING Mingming, ZAHNG Lili, SUN Zhaoyan, SHI Tongfei, HUANG Yineng. Finite Element Analysis of Mechanical Properties of Polyimide Fiber under Thermal Field[J]. Chinese Journal of Applied Chemistry, ;2020, 37(2): 190-197. doi: 10.11944/j.issn.1000-0518.2020.02.190238 shu

Finite Element Analysis of Mechanical Properties of Polyimide Fiber under Thermal Field

  • Corresponding author: SHI Tongfei, tfshi@ciac.ac.cn HUANG Yineng, ynhuang@nju.edu.cn
  • Received Date: 6 September 2019
    Revised Date: 11 October 2019
    Accepted Date: 12 November 2019

    Fund Project: Supported by the National Natural Science Foundation of China(No.21647114)the National Natural Science Foundation of China 21647114

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  • Using COMSOL Multiphysics 5.3 package, we establish a three-dimensional finite element model to calculate the mechanical properties of polyimide fibers with the temperature field generated by the solid heat transfer and surface radiation heat transfer. We analyze the effects of the size and location of holes and the difference of thermal expansion coefficient on the mechanical properties of polyimide fibers. The results indicate that under the condition of polyimide fiber with fixed constraints at both ends, the stress exhibits the similar trends in the temperature fields generated by solid heat transfer and surface radiation heat transfer. The holes in the polyimide fiber reduce the mechanical properties, which results in the larger holes corresponding to the more unbalanced stress distribution. This is more unfavorable to the stability of the polyimide fibers. Meanwhile, the stress decreases with the increase of negative axial coefficient of thermal expansion.
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