Citation: SHI Ji-Peng, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min. Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface[J]. Acta Physico-Chimica Sinica, ;2013, 29(12): 2579-2584. doi: 10.3866/PKU.WHXB201310092 shu

Electrocrystallization of Cu-Sn Alloy on Copper Electrode Surface

1.
State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China

Received Date: 30 July 2013
Available Online: 9 October 2013
Fund Project: 国家自然科学基金(21021002) (21021002)国家重点基础研究发展计划(973) (2009CB930703)资助项目 (973) (2009CB930703)

The co-deposition and electrocrystallization of Cu-Sn alloy in a weak acidic citrate bath were studied by linear sweep voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry. The Scharifker- Hill (SH) theory model and Heerman-Tarallo (HT) theory model were applied to analyze the chronoamperometry data. The results show that the Cu-Sn alloy co-deposited on copper electrode, following instantaneous nucleation with three-dimensional (3D) growth under diffusion control. The kinetic parameters were obtained using the HT model. As the step potential shifted from -0.80 to -0.85 V, the nucleation rate constant (A) increased from 20.19 to 177.67 s^-1, the density of active nucleation sites (N₀) increased from 6.10×10⁵ to 1.42×10⁶ cm^-2, and the diffusion coefficient (D) was (6.13±0.62)×10^-6 cm²·s^-1.
- Cu-Sn alloy,
- Electrocrystallization,
- Cyclic voltammetry,
- Chronoamperometry
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