Citation: Dan Sun, Xinyu Liu, Na Chen, Hao Wang, You Huang, Haiyan Wang. The Growth Behavior and Influencing Factors of Zinc Dendrite in Zinc Electroplating Process[J]. University Chemistry, ;2023, 38(4): 68-77. doi: 10.3866/PKU.DXHX202211076 shu

The Growth Behavior and Influencing Factors of Zinc Dendrite in Zinc Electroplating Process

College of Chemistry and Chemical Engineering, Changsha 410083, China

Corresponding author: Haiyan Wang, wanghy419@csu.edu.cn
Received Date: 24 November 2022

Electroplating is an important part of electrochemical system. In order to broaden the knowledge structure, and cultivate innovation consciousness and scientific literacy of students, zinc electroplating is introduced into the laboratory teaching of applied electrochemistry major. In this experiment, the cause of the zinc dendrites formation in the process of zinc electroplating is analyzed theoretically, and then two corresponding strategies of eliminating surface heterogeneity and adding cationic additives are proposed to inhibit the production of zinc dendrites. In order to deepen the understanding of zinc plating process, we set up an in situ optical microscope to directly observe the change of zinc deposition behavior. This experiment deeply integrates the scientific thinking and innovative ideas of frontier research, guides students to jump out of the textbook framework, stimulates students’ interest in scientific research, and therefore contributes to the cultivation of students’ scientific thinking ability.
- Zinc electroplating,
- Zinc dendrites,
- Surface heterogeneity,
- Cationic additives,
- In situ optical microscopy
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