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Citation: ZHAO Yan, LIN Chang-Jian, LI Yan, DU Rong-Gui, WANG Jing-Run. Electrochemical Corrosion Behavior of Copper Clad Laminate in NaCl Solution[J]. Acta Physico-Chimica Sinica, ;2007, 23(09): 1342-1346. doi: 10.1016/S1872-1508(07)60070-9 shu

Electrochemical Corrosion Behavior of Copper Clad Laminate in NaCl Solution

1.
State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China

Received Date: 20 April 2007
Available Online: 22 July 2007

Comparing with pure copper, the corrosion behavior of copper clad laminate (CCL) in NaCl solution was studied by using linear polarization, cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS). It was shown that CCL had a different corrosion behavior and showed a lower corrosion resistance compared with the pure copper. At low polarization potential, CCL dissolves through the formation of CuCl-2 , which may be a determined step in the anodic process. And when the polarization potential increased, a porous filmcontaining CuCl formed on the CCL surface, and the transportation of Cl- in the film became the controlling step in the corrosion process. An inductive loop at low frequency was observed in the EIS measurement, which was attributed to the modulation of CuCl film due to the competition between dissolution and growth processes on CCL surface.
- Copper clad laminate; Cyclic voltammetry; Electrochemical impedance spectroscopy; Corrosion mechanism
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