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Citation: JIANG Tai-Xiang, WU Hui-Huang. Effects of Codeposition of Cu on Microstructure and Thermal Stability of Electroless Ni-P Coatings[J]. Chinese Journal of Applied Chemistry, ;2000, 17(5): 578-580. shu

Effects of Codeposition of Cu on Microstructure and Thermal Stability of Electroless Ni-P Coatings

1.
State Key Laboratory for Physical Chemistry of Solid Surfaces, Department of Chemistry, Xiamen University, Xiamen 361005

Received Date: 3 January 2000
Available Online: 27 May 2000

The electroless Ni-Cu-P coatings with different Cu content have been deposited from alkaline bath. The surface morphology, microstructure and crystallization behaviour of the electroless Ni-Cu-P alloys have been studied by SEM, XRD and DSC. The results show that the concentration of CuSO₄·5H₂O in the bath has a great effect on the composition of the deposits and the deposition rate. The codeposition of a small amount of Cu makes the crystal grains of the deposits become smaller, but with the Cu content increasing, the deposits exhibit a larger grain size and a more coarse surface morphology. The thermal stability of Ni-Cu-P deposit increases with the Cu content increasing in the deposits.
- electroless plating,
- Ni-Cu-P alloy,
- microstructure,
- thermal stability
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