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Citation: HE Han-Wei, HU Yue-Hua, HUANG Ke-Long. Electrochemical Behavior of Copper in Methylamine Aqueous Solution Containing K₃Fe(CN)₆ during CMP[J]. Chinese Journal of Applied Chemistry, ;2001, 18(11): 893-897. shu

Electrochemical Behavior of Copper in Methylamine Aqueous Solution Containing K₃Fe(CN)₆ during CMP

1.
a College of Chemistry and Chemical Engineering;
2.
b Department of Mineral Engineering, Central South University, Changsha 410083

Received Date: 17 May 2001
Available Online: 6 August 2001
Fund Project: 国家杰出青年科学基金资助(59925412) (59925412)湖南省优秀中青年科技基金资助(98JZY2167) (98JZY2167)

The influences of concentrations of medium and passivator on film surface of copper and polishing process have been studied by electrochemical messurements as functions of polishing pressures, disk rates, film thickness and tightness in chemical mechanical polishing(CMP) process. Electrochemical variables, such as E-corrosion and I-corrosion explaining CMP processes and polishing rates were investigated. The following conclusions were obtained: 1)The concentrations of medium and passivator played a key role in passive film thickness and tightness on the surface of copper; 2)The polishing pressures and rotative rates depended on film thickness and tightness; 3)The removing and regenerating rates of the film influenced the CMP process.
- copper,
- chemical-mechanical polishing,
- electrochemical behavior
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Electrochemical Behavior of Copper in Methylamine Aqueous Solution Containing K3Fe(CN)6 during CMP

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Electrochemical Behavior of Copper in Methylamine Aqueous Solution Containing K₃Fe(CN)₆ during CMP