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Citation: SHAN Chuan-Li, HUANG Xin-Min, WU Yu-Cheng, ZHANG Zhi-Ming, LIN Zhi-Ping. Effect of Cu Content in Electroless Ni-Cu-P Coatings on Their Microstructure and Properties[J]. Chinese Journal of Applied Chemistry, ;2008, 25(10): 1161-1165. shu

Effect of Cu Content in Electroless Ni-Cu-P Coatings on Their Microstructure and Properties

1.
School of Material Science and Engineering, Hefei University of Technology, Hefei 230009

Corresponding author: HUANG Xin-Min,
Received Date: 29 September 2007
Available Online: 18 December 2007
Fund Project: 国家自然科学基金资助项目(20571022) (20571022)

Ni-Cu-P coatings were obtained by electroless plating.The effects of CuSO₄·5H₂O concentration in bath on the deposition rate and composition of Ni-Cu-P coatings were investigated.Microstructures and morphologies of Ni-Cu-P coatings obtained at various CuSO₄·5H₂O concentrations were analyzed via XRD and SEM.Corrosion resistances of Ni-Cu-P coatings were evaluated via polarization curves in 3.5% NaCl solution.The results show the deposition rate and P content of coatings decrease with the increasing of CuSO₄·5H₂O concentration in bath.P mass content in Ni-P coating was 14.98%.P mass content in coating was 4.21% when CuSO₄·5H₂O concentration in bath was 1.0 g/L.Crystallinity of coatings grows with the increasing of Cu content in electroless coatings.Addition of Cu in electroless bath makes the morphology of electroless coatings much smooth.Corrosion resistance of coatings first increased and then decreased with the increasing of CuSO₄·5H₂O concentration in bath.Ni-Cu-P coating obtained at 0.4 g/L CuSO₄ concentration in bath performs optimal corrosion resistance.
- electroless plating,
- Ni-Cu-P,
- microstructure,
- corrosion
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