Citation: YANG Li-Kun, YANG Fang-Zu, TIAN Zhong-Qun, ZHOU Shao-Min. Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum[J]. Acta Physico-Chimica Sinica, ;2012, 28(02): 414-420. doi: 10.3866/PKU.WHXB201112011 shu

Initial Behavior of the Electroless Nickel Deposition on Pretreated Aluminum

1.
State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China

Received Date: 8 October 2011
Available Online: 1 December 2011
Fund Project: 国家自然科学基金(20873114, 20833005, 21021002) (20873114, 20833005, 21021002) 国家重点基础研究发展规划项目(973) (2009CB930703) (973) (2009CB930703)福建省科技计划项目(2009H4020)资助 (2009H4020)

The initial behavior of electroless nickel deposition on aluminum pretreated by nickel immersion and electroless nickel pre-plating processes was studied measuring the open circuit potential (OCP) as a function of time (E_OCP-t). Scanning electron microscopy (SEM) was used to observe the surface morphology of the pretreated specimens. During the initial stages of the electroless nickel deposition, all pretreated and un-pretreated aluminum substrates experienced removal of the oxide film, activation, mixed control and electroless nickel deposition. After nickel immersion and electroless nickel pre-plating, fine nickel particles were attached to the surface of the aluminum. Our experimental results, including E_OCP-t and SEM, indicate that electroless nickel plating in a weak acidic bath was successfully accomplished on the aluminum pretreated with a double treatment of electroless nickel pre-plating in an alkaline nickel solution containing a complexing agent and a reductant. The nickel coating obtained adhered to the aluminum substrate, had a granular appearance and an amorphous structure.
- Electroless nickel plating,
- Aluminum,
- Nickel immersion,
- Electroless nickel pre-plating,
- Open circuit potential
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