Citation: JIA Fei, WANG Zhou-Cheng. Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant[J]. Acta Physico-Chimica Sinica, ;2011, 27(03): 633-640. doi: 10.3866/PKU.WHXB20110302 shu

Electrochemical Study on Electroless Nickel Plating Using Sodium Borohydride as the Reductant

JIA Fei ,
WANG Zhou-Cheng

1.
Department of Chemical and Biochemical Engineering, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, Fujian Province, P. R. China

Received Date: 23 September 2010
Available Online: 18 January 2011
Fund Project: 国家自然科学基金(20573086)资助项目 (20573086)

We studied electroless Ni-B plating with sodium borohydride as the reductant by linear sweep voltammetry. The effects of bath solution composition and operating conditions on the cathodic reduction and anodic oxidation were studied. Increases in the concentrations of nickel acetate and sodium borohydride accelerated the reduction of Ni²⁺ and the oxidation of BH₄^-, respectively. Ethylenediamine, sodium hydroxide, thiourea and saccharin sodium inhibited both the cathodic and anodic reactions to varying degrees. Additionally, sulfur in the additives promoted the dissolution of nickel. High temperature was beneficial to both the cathodic reduction and anodic oxidation.
- Electroless nickel plating,
- Cathodic reduction,
- Anodic oxidation,
- Polarization,
- Additive,
- Adsorption
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