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Citation: Ren Ju-Jie, Yang Mai-Zhi, Tong Ru-Ting, Guo Qin-Lin, Cai Sheng-Min, Zhou Guo-Ding. Photoelectrochemical Study on the Corrosion Behavior of Copper in 3% NaCl Solution[J]. Acta Physico-Chimica Sinica, ;1994, 10(05): 452-455. doi: 10.3866/PKU.WHXB19940516 shu

Photoelectrochemical Study on the Corrosion Behavior of Copper in 3% NaCl Solution

1.
Department of Chemistry, Hebei University 050016; Department of Chemistry, Peking Univeristy 100871; Department of Thermal Power Engineering, Shanghai Institute of Electric Power 200090

Received Date: 20 October 1992
Available Online: 15 May 1994

The corrosion behavior of copper in 3% NaCl solutions has been investigated using AES. XPS and photoelectrochemical tectniques. The results show that Cl~- has remarkable influence on the corrosion behavior of copper. With the increasing immersion time, the photoresponse of copper electrode changes from p-type to n-type gradually, and the invasion degree of Cl~- ions on copper electrode increases. Finally, the band gap of the sedriconduct film formed on copper electrode surface is 1.7 eV.
- Cu,
- Photocurrent (Iph),
- Open circuit photovoltage (Voph),
- Cl-
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