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Citation: GAO Wei, LIU Ruiquan, MI Hongyu. Electrodeposition Behaviors of Copper in Ionic Liquid[J]. Chinese Journal of Applied Chemistry, ;2014, 31(2): 212-219. doi: 10.3724/SP.J.1095.2014.30129 shu

Electrodeposition Behaviors of Copper in Ionic Liquid

1.
College of Chemistry and Chemical Engineering, Xinjiang University, Urumqi 830046, China

Corresponding author: LIU Ruiquan,
Received Date: 15 March 2013
Available Online: 8 April 2013
Fund Project: 国家自然科学基金资助项目(21063013) (21063013)新疆维吾尔自治区高校科研计划项目(XJEDU2012I05) (XJEDU2012I05)

The electrodeposition of metallic copper in the solution of ethylene glycol(EG) and 1-butyl-3-methylimidazolium chloride(BMIC) containing CuCl₂ was studied.The effect of EG on the viscosity and the effect of BMIC on the conductivity are investigated.Cyclic voltammetry was performed to study the electrodeposition of Cu(Ⅱ) in BMIC-CuCl₂-EG.The electrodeposition of Cu(Ⅱ) was affected by the scanning rate,temperature and the content of EG.The reduction of Cu(Ⅱ) consists of two processes.Both the redox processes of Cu(Ⅱ)/Cu(Ⅰ) and Cu(Ⅰ)/Cu are irreversible,in which Cu(Ⅱ)/Cu(Ⅰ) is under the control of diffusion.The diffusion coefficient of Cu(Ⅱ)/Cu(Ⅰ) is calculated to be 7.0×10^-7 cm²/s and the transfer coefficient to be 0.24 at the temperature of 343 K.The metallic copper grains were electrodeposited on the copper film.Based on the scanning electron microscope micrographs,these grains demonstrate the dense location after the electrodeposition for 30 minutes at 343 K.These grains turn into globular morphology after the electrodeposition for 2 h.
- cyclic voltammetry,
- butyl-methylimidazolium chloride,
- copper,
- electrodeposition,
- ethylene glycol
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