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Citation: DAI Shimei, HAN Guangshuai, DU Caigang, GAO Yanmin. Anti-oxidation of Epoxy Resin Conductive Adhesive Copper Powder[J]. Chinese Journal of Applied Chemistry, ;2013, 30(6): 677-682. doi: 10.3724/SP.J.1095.2013.20363 shu

Anti-oxidation of Epoxy Resin Conductive Adhesive Copper Powder

School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China

Received Date: 23 August 2012
Revised Date: 25 October 2012

According to the nature of copper,γ-amino propyl methyl di-ethoxy-silane(KH-902) is selected to modify copper. FT-IR,digital microscope,TG,SEM and EDS have been used to characterize the modified copper and the copper-filled conductive adhesive. The results show that the addition of silane coupling agent KH-902 can improve the antioxidation ability. When the addition of KH-902 is 3%,it can significantly improve not only the oxidation resistance of the copper-filled conductive adhesive in high temperature curing,but also the dispersion of copper in the epoxy resin colloid system,and make the combination between copper and copper better,which is the superior conductivity of system with bulk resistance rate of 1.31 × 10^-2 Ω·cm.
- filled conductive adhesive,
- copper,
- silane coupling agent,
- oxidation resistance
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