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Citation: WANG Yanru, LI Wenpo, WU Jinfang, ZHANG Shengtao. In-situ Ellipsometric Study of Lead Electrodeposition on Polycrystalline Cu[J]. Chinese Journal of Applied Chemistry, ;2011, 28(1): 55-59. doi: 10.3724/SP.J.1095.2011.00140 shu

In-situ Ellipsometric Study of Lead Electrodeposition on Polycrystalline Cu

1.
College of Chemistry and Chemical Engineering, Chongqing University, Chongqing 400044

Corresponding author: LI Wenpo,
Received Date: 9 March 2010
Available Online: 28 April 2010
Fund Project: 重庆市自然科学基金重点项目(CSTC,2008BC4020) (CSTC,2008BC4020)中国博士后科学基金(20090450781)资助项目 (20090450781)

Electrodeposition of Pb on polycrystalline Cu surfaces has been investigated by cyclic voltammetry (CV) and in-situ spectroscopic ellipsometry(SE). The ellipsometric parameters Ψ and Δ peak corresponded to both underpotential deposition (UPD) and bulk deposition peak potentials. The "substrate-solution" interface structure was described with a single-layer model,(substrate Cu-deposition Pb layer) and the thicknesses of Pb layer for different scan potentials were obtained by fitting experimental data with the model. Fitting results showed that Pb electrodeposition on the Cu electrode was with three different deposition rates,-0.20~-0.35 V,0.003 nm/mV;-0.35~-0.48V,0.025 nm/mV;-0.48~-0.60 V,0.116 nm/mV. Based on the fitting results, three stages, which were formation of UPD layer, transitional period between the UPD and bulk deposition and formation of bulk deposition layer were proposed for the electrodeposition process of copper in the Pb²⁺ solution.
- in-situ spectroscopic ellipsometry,
- lead electrodeposition,
- copper
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