Citation: Kang Chen, Junan Pan, Weinan Yin, Chiyu Ma, Longlu Wang. Flexible electronics based on one-dimensional inorganic semiconductor nanowires and two-dimensional transition metal dichalcogenides[J]. Chinese Chemical Letters, ;2023, 34(11): 108226. doi: 10.1016/j.cclet.2023.108226 shu

Flexible electronics based on one-dimensional inorganic semiconductor nanowires and two-dimensional transition metal dichalcogenides

College of Electronic and Optical Engineering & College of Flexible Electronics (Future Technology), Nanjing University of Posts & Telecommunications (NUPT), Nanjing 210023, China

wanglonglu@njupt.edu.cn

Received Date: 6 November 2022
Revised Date: 13 December 2022
Accepted Date: 14 February 2023
Available Online: 16 February 2023

Figures(10)

Flexible electronics technology is considered as a revolutionary technology to unlock the bottleneck of traditional rigid electronics that prevalent for decades, thereby fueling the next-generation electronics. In the past few decades, the research on flexible electronic devices based on organic materials has witnessed rapid development and substantial achievements, and inorganic semiconductors are also now beginning to shine in the field of flexible electronics. As validated by the latest research, some of the inorganic semiconductors, particularly those at low dimension, unexpectedly exhibited excellent mechanical flexibility on top of superior electrical properties. Herein, we bring together a comprehensive analysis on the recently burgeoning low-dimension inorganic semiconductor materials in flexible electronics, including one-dimensional (1D) inorganic semiconductor nanowires (NWs) and two-dimensional (2D) transition metal dichalcogenides (TMDs). The fundamental electrical properties, optical properties, mechanical properties and strain engineering of materials, and their performance in flexible device applications are discussed in detail. We also propose current challenges and predict future development directions including material synthesis and device fabrication and integration.
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