W掺杂NbSe<sub>2</sub>及其Cu基复合材料摩擦学性能研究

引用本文: 胡志立, 李长生, 唐华, 李洪苹, 梁家青, 张毅, 陈帅. W掺杂NbSe₂及其Cu基复合材料摩擦学性能研究[J]. 无机化学学报, 2013, 29(4): 767-773. doi: 10.3969/j.issn.1001-4861.2013.00.101 shu

Citation: HU Zhi-Li, LI Chang-Sheng, TANG Hua, LI Hong-Ping, LIANG Jia-Qing, ZHANG Yi, CHEN Shuai. Investigation of W Doped NbSe₂ and Tribology Characteristic of Its Correlated Copper Base Composites[J]. Chinese Journal of Inorganic Chemistry, 2013, 29(4): 767-773. doi: 10.3969/j.issn.1001-4861.2013.00.101 shu

W掺杂NbSe₂及其Cu基复合材料摩擦学性能研究

胡志立 ^1, ,
李长生 ^1,2, ,
唐华 ^2, ,
李洪苹 ^2, ,
梁家青 ^2, ,
张毅 ^2, ,
陈帅 ^2,

基金项目:
江苏省自然科学基金(No.BK2011534) (No.BK2011534)

兰州化学物理所固体润滑国家重点实验室开放基金(No.20101008) (No.20101008)

江苏省摩擦学重点实验室开放基金(No.kjsmcx1005) (No.kjsmcx1005)

江苏大学高级人才启动基金(No.09JDG009)资助项目。 (No.09JDG009)

摘要: 本文利用固相合成法制备W掺杂的NbSe₂, 且以Nb_1-xW_xSe₂为固体润滑相, Cu为基体相, 通过粉末冶金的方法制备出不同质量百分比含量的Nb_1-xW_xSe₂/Cu基复合材料。利用XRD、SEM、TEM测试手段分析了样品中的相成分、微观形貌, 采用电阻率检测仪、材料试验机和排水法测试块体样品的电阻率、硬度和密度, 并用摩擦磨损试验机对其摩擦磨损性能进行评价。结果表明随着W掺杂量的增加, Nb_1-xW_xSe₂的形貌由规则的微米六方片转变为纳米片和纳米带的混合, 掺杂对电阻率影响不大。随着Nb_1-xW_xSe₂添加量的增加, Nb_1-xW_xSe₂/Cu基复合材料的电阻率缓慢升高, 摩擦系数呈现不同规律变化。当Nb_1-xW_xSe₂中W掺杂量x=0且其添加质量为10% 时, NbSe₂/Cu基复合材料体系拥有最佳摩擦磨损性能, 摩擦系数为0.15, 磨痕平滑且宽度较窄。当Nb_1-xW_xSe₂中W掺杂量x=3%且Nb_0.97W_0.03Se₂的添加质量为5%时, Nb_0.97W_0.03Se₂/Cu基复合材料拥有最佳摩擦磨损性能, 摩擦系数为0.17, 磨痕更加平滑且磨痕浅。这是由于Nb_0.97W_0.03Se₂中同时均匀存在纳米带和纳米片, 它们互相缠绕在一起, 在复合材料中纳米片起到润滑成膜的作用, 纳米带类似于鸟巢中的草屑和树枝, 起到了增强增韧的作用, 促使材料的力学和摩擦学性能同时提高。

关键词:

NbSe₂;W掺杂;Cu基复合材料;摩擦性能;润滑

English

Investigation of W Doped NbSe₂ and Tribology Characteristic of Its Correlated Copper Base Composites

1.
1 School of Mechanical Engineering, Jiangsu University, Key Laboratory of Tribology of Jiangsu Province, Zhenjiang, Jiangsu 212013, China;
Received Date: 04 October 2012
Fund Project:
江苏省自然科学基金(No.BK2011534)

兰州化学物理所固体润滑国家重点实验室开放基金(No.20101008)

江苏省摩擦学重点实验室开放基金(No.kjsmcx1005)

江苏大学高级人才启动基金(No.09JDG009)资助项目。

Abstract: In this paper, W doped NbSe₂ was prepared by solid phase synthesis method. Then Nb_1-xW_xSe₂ copper base composites were synthesized by powder metallurgy method with a series of Nb1 -xW_xSe₂ concentration, using Nb_1-xW_xSe₂ as solid lubrication phase and Cu as matrix phase. Phase identification and microstructure analysis of the resultant samples were carried out by XRD, SEM and TEM. The electrical resistance, hardness, and density of the block samples was measured with resistivity detector, electronic material testing machine and drainage method, respectively. The friction and wear performance was evaluated with friction and wear testing machine. It is found that the microstructure of Nb_1-xW_xSe₂ changes from micron hexagonal sheet to the mixed of nanometer sheet and nanobelts with increasing W doping ratio. Whereas, there is nearly no influence on the resistance. Further, the resistivity of Nb_1-xW_xSe₂/Cu base composites gradually becomes stronger as increasing the concentration of Nb_1-xW_xSe₂, however, the friction coefficient exhibits different values. When x=0 and the percentage of Nb_1-x W_xSe₂ is 10%, the NbSe₂/Cu base composite presents the best friction and wear properties, i.e., the friction coefficient is 0.15 and wear scar is smooth and narrow. When x=3% and the percentage of Nb_1-xW_xSe₂ is 5%, the Nb_0.97W_0.03Se₂/Cu base composite presents the best friction and wear properties, i.e., the friction coefficient is 0.17 and wear scar is smoother and shallow. Since both nanobelts and nanosheet are existed in Nb_0.97W_0.03Se₂ and they are intertwined, in the composites the nanosheets play an important role in the lubrication film and the winding nanobelts, which similar to the grass and branches of bird′s nest, enhance its toughening effect. Hence, both the mechanical and tribological properties of the composites are improved.

Key words:

NbSe₂;W-doped;copper base composites;tribology characteristic;lubricate

1. [1] Tenne R, Margulis L, Genut M, et al. Nature, 1992,360:444 -446[1] Tenne R, Margulis L, Genut M, et al. Nature, 1992,360:444 -446
2. [2] Rothschild A, Sloan J, Tenne R. J. Am. Chem. Soc., 2000, 122:5169-5179[2] Rothschild A, Sloan J, Tenne R. J. Am. Chem. Soc., 2000, 122:5169-5179
3. [3] Feldman Y, Wasserman E, Srolovitz D J, et al. Science, 1995, 267:222-225[3] Feldman Y, Wasserman E, Srolovitz D J, et al. Science, 1995, 267:222-225
4. [4] Bilas P, Romana L Bade F, et al. Tribol. Lett., 2009,34(1): 41-48[4] Bilas P, Romana L Bade F, et al. Tribol. Lett., 2009,34(1): 41-48
5. [5] Li C S, Hao M D, Liu Y Q, et al. 2008 3rd Ieee Int. Confer. Nano/Micro Eng. Mol. Sys., 2008,1-3:324-328[5] Li C S, Hao M D, Liu Y Q, et al. 2008 3rd Ieee Int. Confer. Nano/Micro Eng. Mol. Sys., 2008,1-3:324-328
6. [6] Suderow H, Tissen V G, Brison J P, et al. Phys. Rev. Lett., 2005,95(11):117006-117006[6] Suderow H, Tissen V G, Brison J P, et al. Phys. Rev. Lett., 2005,95(11):117006-117006
7. [7] Rapoport L, Fleischer N, Tenne R. Adv. Mater., 2003,15: 651-655[7] Rapoport L, Fleischer N, Tenne R. Adv. Mater., 2003,15: 651-655
8. [8] Papoport L, Lvovsky M,Lapsker I, et al. Adv. Eng. Mater., 2001,3:71-75[8] Papoport L, Lvovsky M,Lapsker I, et al. Adv. Eng. Mater., 2001,3:71-75
9. [9] CHEN Wei-Xiang(陈卫祥), TU Jiang-Ping(涂江平), MA Xiao -Chun(马晓春). Chin. J. Tribol.(Mocaxue Xuebao), 2003,23 (1):76-80[9] CHEN Wei-Xiang(陈卫祥), TU Jiang-Ping(涂江平), MA Xiao -Chun(马晓春). Chin. J. Tribol.(Mocaxue Xuebao), 2003,23 (1):76-80
10. [10] CAO Ke-Sheng(曹可生), LI Chang-Sheng(李长生), LI Song-Tian(李松田), et al. Chinese J. Inorg. Chem.(Wuji Huaxue Xuebao), 2011,11(27):2150-2156[10] CAO Ke-Sheng(曹可生), LI Chang-Sheng(李长生), LI Song-Tian(李松田), et al. Chinese J. Inorg. Chem.(Wuji Huaxue Xuebao), 2011,11(27):2150-2156
11. [11] Pol S V, Pol V G, Moreno G, et al. J. Phys. Chem. C, 2008, 112:5356-5360[11] Pol S V, Pol V G, Moreno G, et al. J. Phys. Chem. C, 2008, 112:5356-5360
12. [12] Parilla P, Dillon A C, Parkinson B, et al. J. Phys. Chem. B, 2004,08:197-207[12] Parilla P, Dillon A C, Parkinson B, et al. J. Phys. Chem. B, 2004,08:197-207
13. [13] TANG Guo-Gang(唐国钢), LI Chang-Sheng(李长生), TANG Hua(唐华), et al. Chinese J. Inorg. Chem.(Wuji Huaxue Xuebao), 2011,27(7):1368-1372[13] TANG Guo-Gang(唐国钢), LI Chang-Sheng(李长生), TANG Hua(唐华), et al. Chinese J. Inorg. Chem.(Wuji Huaxue Xuebao), 2011,27(7):1368-1372
14. [14] JIN Yue(晋跃), LI Chang-Sheng(李长生), WANG Mu-Ju(王木菊), et al. Chin. J. Vacauum Sci. Technol.(Zhenkong Kexue Yu Jishu Xuebao), 2011,31(5):646-651[14] JIN Yue(晋跃), LI Chang-Sheng(李长生), WANG Mu-Ju(王木菊), et al. Chin. J. Vacauum Sci. Technol.(Zhenkong Kexue Yu Jishu Xuebao), 2011,31(5):646-651
15. [15] LI Guo-Wei(李国伟), JIN Yue(晋跃), LI Chang-Sheng(李长生), et al. Chinese J. Inorg. Chem.(Wuji Huaxue Xuebao), 2010,26(8):1472-1476[15] LI Guo-Wei(李国伟), JIN Yue(晋跃), LI Chang-Sheng(李长生), et al. Chinese J. Inorg. Chem.(Wuji Huaxue Xuebao), 2010,26(8):1472-1476
16. [16] Prabu M, Selvasekarapandian S, Kulkarni A R, et al. Trans. Nonferrous Met. Soc. China, 2012(22):342-347[16] Prabu M, Selvasekarapandian S, Kulkarni A R, et al. Trans. Nonferrous Met. Soc. China, 2012(22):342-347
17. [17] YANG Meng-Meng(杨萌萌), TU Hai-Lin(屠海令), ZHANG Xin-Qiang(张心强), et al. Chin. J. Rare Metals(Xiyou Jinshu Xuebao), 2012,36(2):292-296[17] YANG Meng-Meng(杨萌萌), TU Hai-Lin(屠海令), ZHANG Xin-Qiang(张心强), et al. Chin. J. Rare Metals(Xiyou Jinshu Xuebao), 2012,36(2):292-296
18. [18] Chung S Y, Bloking J T, Chiang Y M. Nature Mater., 2002, 1:123-128[18] Chung S Y, Bloking J T, Chiang Y M. Nature Mater., 2002, 1:123-128
19. [19] Ni J F, Zhou H H, Chen J T, et al. Mater. Lett., 2002,59: 2361-2365[19] Ni J F, Zhou H H, Chen J T, et al. Mater. Lett., 2002,59: 2361-2365
20. [20] Shi S Q, Liu L J, Ouyang C Y, et al. Phys. Rev. B, 2003,68: 195108-195112[20] Shi S Q, Liu L J, Ouyang C Y, et al. Phys. Rev. B, 2003,68: 195108-195112
21. [21] FENG Liang-Rong(冯良荣), LÜ Shao-Jie(吕绍洁), QIU Fa-Li(邱发礼). Acta Chim. Sin.(Huaxue Xuebao), 2002,60(3): 463-467[21] FENG Liang-Rong(冯良荣), LÜ Shao-Jie(吕绍洁), QIU Fa-Li(邱发礼). Acta Chim. Sin.(Huaxue Xuebao), 2002,60(3): 463-467
22. [22] Choi W, Termin A, Hoffmann M R. J. Phys. Chem., 1994, 98:13669-13679[22] Choi W, Termin A, Hoffmann M R. J. Phys. Chem., 1994, 98:13669-13679
23. [23] Iwasaki M, Hara M, Kawada H, et al. J. Colloid Interface Sci., 2000,224(1):202-204[23] Iwasaki M, Hara M, Kawada H, et al. J. Colloid Interface Sci., 2000,224(1):202-204
24. [24] YUE Lin-Hai(岳林海), SHUI Miao(水淼), XU Zhu-De(徐铸德), et al. J. Zhejiang Univ.: Sci. Ed.(Zhejiang Daxue Xuebao: Lixueban), 2000,27(1):69-74[24] YUE Lin-Hai(岳林海), SHUI Miao(水淼), XU Zhu-De(徐铸德), et al. J. Zhejiang Univ.: Sci. Ed.(Zhejiang Daxue Xuebao: Lixueban), 2000,27(1):69-74
25. [25] Michael Gratzel, Russell F Howe. J. Phys. Chem., 1990,94: 2566-2572[25] Michael Gratzel, Russell F Howe. J. Phys. Chem., 1990,94: 2566-2572
26. [26] PENG Zhi-Jian(彭志坚), YANG Yi-Yong(杨义勇), WANG Cheng-Biao(王成彪), et al. Acta Metellu. Sin.(Jinshu Xuebao), 2008,44(10):1265-1270[26] PENG Zhi-Jian(彭志坚), YANG Yi-Yong(杨义勇), WANG Cheng-Biao(王成彪), et al. Acta Metellu. Sin.(Jinshu Xuebao), 2008,44(10):1265-1270
27. [27] Balzer B, Hagemeister M, Kocher P, et al. J. Am. Ceram. Soc., 2004,87:1932-1938[27] Balzer B, Hagemeister M, Kocher P, et al. J. Am. Ceram. Soc., 2004,87:1932-1938
28. [28] Begum S, Hashmi M S J. J. Mater. Process Technol., 2005, 167:542-548[28] Begum S, Hashmi M S J. J. Mater. Process Technol., 2005, 167:542-548
29. [29] WANG Qing-Feng(万庆峰), WANG De-Zhi(王德志), ZHAO Bing(赵兵), et al. Transact. Meterals Heat Treat.(Cailiao Rechuli Xuebao), 2009,30(1):80-83[29] WANG Qing-Feng(万庆峰), WANG De-Zhi(王德志), ZHAO Bing(赵兵), et al. Transact. Meterals Heat Treat.(Cailiao Rechuli Xuebao), 2009,30(1):80-83
30. [30] He D H, Manory R. Wear, 2001,249:626-636[30] He D H, Manory R. Wear, 2001,249:626-636
31. [31] Kato H, Takama M, Iwai Y. Wear, 2003,255:573-578[31] Kato H, Takama M, Iwai Y. Wear, 2003,255:573-578
32. [32] Rajora O S, Curzon A E. Phys. Status Solidi (A), 1986,97:65 -76[32] Rajora O S, Curzon A E. Phys. Status Solidi (A), 1986,97:65 -76
33. [33] Voorhoeve-Van D B J M. J. Less-common Metals, 1972,26: 399-402[33] Voorhoeve-Van D B J M. J. Less-common Metals, 1972,26: 399-402
34. [34] Freund J, Wortmann G, Paulus W, et al. J. Alloys Compd., 1992,187:157-169[34] Freund J, Wortmann G, Paulus W, et al. J. Alloys Compd., 1992,187:157-169
35. [35] Tang H, Cao K S, Wu Q, et al. Cryst. Res. Technol., 2011, 46(2):195-200[35] Tang H, Cao K S, Wu Q, et al. Cryst. Res. Technol., 2011, 46(2):195-200
36. [36] LI Wen-Jing(李文静), LEI Lei(雷蕾), LUO Cong(罗聪), et al. Chinese J. Inorg. Chem.(Wuji Huaxue Xuebao), 2012, 28(8):1587-1592[36] LI Wen-Jing(李文静), LEI Lei(雷蕾), LUO Cong(罗聪), et al. Chinese J. Inorg. Chem.(Wuji Huaxue Xuebao), 2012, 28(8):1587-1592

扫一扫看文章

计量

PDF下载量: 347
文章访问数: 955
HTML全文浏览量: 97

通讯作者: 陈斌, bchen63@163.com

1.
沈阳化工大学材料科学与工程学院沈阳 110142

W掺杂NbSe₂及其Cu基复合材料摩擦学性能研究

English

Investigation of W Doped NbSe₂ and Tribology Characteristic of Its Correlated Copper Base Composites

CCS Chemistry：嵌段共聚物自组装成 “三明治”二维有机材料，实现纳米级压力传感功能

CCS Chemistry：颜徐州、鲍哲南：你的皮肤可能是一片SPMs

CCS Chemistry：工作高效不疲劳，只须让催化剂动起来

CCS Chemistry：静电组装导向聚合- 聚电解质纳米凝胶量化制备新策略

CCS Chemistry：金黄色葡萄球菌醛基脱氢酶是如何识别特异性底物的？

计量

通讯作者: 陈斌, bchen63@163.com

中国化学会秘书处

W掺杂NbSe2及其Cu基复合材料摩擦学性能研究

English

Investigation of W Doped NbSe2 and Tribology Characteristic of Its Correlated Copper Base Composites

CCS Chemistry：嵌段共聚物自组装成 “三明治”二维有机材料，实现纳米级压力传感功能

CCS Chemistry：颜徐州、鲍哲南： 你的皮肤可能是一片SPMs

CCS Chemistry：工作高效不疲劳，只须让催化剂动起来

CCS Chemistry：静电组装导向聚合- 聚电解质纳米凝胶量化制备新策略

CCS Chemistry：金黄色葡萄球菌醛基脱氢酶是如何识别特异性底物的？

计量

文章相关

通讯作者: 陈斌, bchen63@163.com

中国化学会秘书处

W掺杂NbSe₂及其Cu基复合材料摩擦学性能研究

Investigation of W Doped NbSe₂ and Tribology Characteristic of Its Correlated Copper Base Composites

CCS Chemistry：颜徐州、鲍哲南：你的皮肤可能是一片SPMs