从2AlCl<sub>3</sub>/Et<sub>3</sub>NHCl离子液体中电沉积制备Ni 和Ni-Al 合金

引用本文: 高丽霞, 王丽娜, 齐涛, 余江. 从2AlCl₃/Et₃NHCl离子液体中电沉积制备Ni 和Ni-Al 合金[J]. 物理化学学报, 2012, 28(01): 111-120. doi: 10.3866/PKU.WHXB201228111 shu

Citation: GAO Li-Xia, WANG Li-Na, QI Tao, YU Jiang. Preparation of Ni and Ni-Al Alloys from 2AlCl₃/Et₃NHCl Ionic Liquid by Electrodeposition[J]. Acta Physico-Chimica Sinica, 2012, 28(01): 111-120. doi: 10.3866/PKU.WHXB201228111 shu

从2AlCl₃/Et₃NHCl离子液体中电沉积制备Ni 和Ni-Al 合金

高丽霞 ^1,2, ,
王丽娜 ^1, ,
齐涛 ^1, ,
余江 ^2,

基金项目:
国家重点基础研究发展规划项目(973) (2007CB613501) (973) (2007CB613501)

中国科学院知识创新项目(082814) (082814)

国家自然科学基金(21076019) (21076019)

中央高校基本科研业务费专项资金(ZY1130) (ZY1130)

中国博士后科学基金项目(2011M500224)资助 (2011M500224)

摘要: 在含Ni²⁺的2AlCl₃/Et₃NHCl离子液体中的铜电极上通过恒电位电沉积制备出金属Ni 和Ni-Al 合金. 采用循环伏安和计时电流方法, 揭示铜电极上沉积金属Ni 的成核机理, 研究了电沉积Ni-Al 合金的机理, 以及恒电位沉积Ni-Al 合金工艺条件对沉积Ni-Al 合金表面形貌和电流效率的影响. 结果表明: 在铜电极上电沉积金属Ni的成核机理为受扩散控制的三维瞬时成核过程. 在电量≥3.0 C 时, 电沉积Ni-Al 合金的组成基本不再变化.Ni-Al 合金的电沉积机理为, Ni 的电沉积受扩散控制, 同时进行Al 的欠电位沉积, 在Ni-Al 合金电沉积过程中某些Ni-Al 合金相的沉积可能受动力学限制而使Ni-Al 合金的组成偏离热力学预测结果. 在电沉积Ni-Al 合金的沉积电流小且平稳, 电沉积速率慢条件下, Ni-Al 合金表面形貌致密均一, 反之就会出现瘤节. 电沉积Ni-Al 合金的电流效率>90%. 电沉积物的组成接近于Ni₃Al 合金.

关键词:

English

Preparation of Ni and Ni-Al Alloys from 2AlCl₃/Et₃NHCl Ionic Liquid by Electrodeposition

1.
1. National Engineering Laboratory for Hydrometallurgical Cleaner Production Technology, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, P. R. China;
2. College of Chemical Engineering, Beijing University of Chemical Technology, Beijing 100029, P. R. China
Received Date: 12 August 2011
Available Online: 29 December 2011
Fund Project:
国家重点基础研究发展规划项目(973) (2007CB613501)

中国科学院知识创新项目(082814)

国家自然科学基金(21076019)

中央高校基本科研业务费专项资金(ZY1130)

中国博士后科学基金项目(2011M500224)资助

Abstract: Nickel and nickel-aluminum alloy were successfully electrodeposited on Cu electrodes from 2: 1 molar ratio aluminum chloride (AlCl₃)/triethylamine hydrochloride (Et₃NHCl) ionic liquids containing Ni²⁺ by constant potential electrolysis. The nucleation mechanism of nickel electrodeposition on Cu was investigated by cyclic voltammograms and chronoamperometry. The mechanism and the influence of experimental conditions on the current efficiency and the surface morphology of nickel-aluminum alloy electrodeposition on Cu electrodes were studied. The electrodeposition of nickel on Cu electrodes was controlled by three-dimensional instantaneous nucleation with diffusion-controlled growth. The Ni-Al alloy composition did not become independent of the deposition charge until at least 3.0 C had been accumulated. The mechanism of Ni-Al alloy formation appears to involve the underpotential deposition of aluminum on the developing nickel deposit and alloy formation must be kinetically hindered because the aluminum content is always less than that predicted from theoretical considerations. The Ni-Al alloy that was obtained on the Cu electrode was dense, continuous, and well adherent when the deposition current was small and stationary. If these conditions were not met, a nodule surface morphology appeared. The current efficiency of the Ni-Al alloy electrodeposition was greater than 90% and the deposition composition was close to that of the Ni₃Al alloy.

Key words:

Ionic liquid
/ Aluminum chloride/Triethylamine hydrochloride
/ Constant potential
/ Electrodeposition
/ Nickel-aluminum alloy

1. [1]
  (1) Wu, Z. J.;Wu, X. F.; Yang, J. Machinist Metal Forming 2009, No. 18, 23. [吴朝军, 吴晓峰, 杨杰. 金属加工(热加工), 2009, No. 18, 23.](1) Wu, Z. J.;Wu, X. F.; Yang, J. Machinist Metal Forming 2009, No. 18, 23. [吴朝军, 吴晓峰, 杨杰. 金属加工(热加工), 2009, No. 18, 23.]
2. [2]
  (2) Yin, C. L.; Yu, Y. G.; Zeng, K. L.; Ren, X. J. The Chinese Journal of Process Engineering 2004, 4, 156. [尹春雷, 于月光, 曾克里, 任先京. 过程工程学报, 2004, 4, 156.](2) Yin, C. L.; Yu, Y. G.; Zeng, K. L.; Ren, X. J. The Chinese Journal of Process Engineering 2004, 4, 156. [尹春雷, 于月光, 曾克里, 任先京. 过程工程学报, 2004, 4, 156.]
3. [3]
  (3) Yu, Y. G.; Zeng, K. L.; Song, X. J.; Xu, G. G.; Chen, S. Y.; Xie, J. G. Al-Coated-Ni Composite Powder Coated by Ultramicroor- Nano Al Powder and its Preparation Method. CN. Patent 02100588.5, 2005-07-06. [于月光, 曾克里, 宋希剑, 许根国, 陈舒予, 谢建刚. 超微或纳米铝粉包覆的铝包镍复合粉末及其制备方法: 中国, 02100588.5[P]. 2005-07-06.](3) Yu, Y. G.; Zeng, K. L.; Song, X. J.; Xu, G. G.; Chen, S. Y.; Xie, J. G. Al-Coated-Ni Composite Powder Coated by Ultramicroor- Nano Al Powder and its Preparation Method. CN. Patent 02100588.5, 2005-07-06. [于月光, 曾克里, 宋希剑, 许根国, 陈舒予, 谢建刚. 超微或纳米铝粉包覆的铝包镍复合粉末及其制备方法: 中国, 02100588.5[P]. 2005-07-06.]
4. [4]
  (4) Moffat, T. P. J. Electrochem. Soc. 1994, 141, L115.(4) Moffat, T. P. J. Electrochem. Soc. 1994, 141, L115.
5. [5]
  (5) Uchida, J.; Tsuda, T.; Yamamoto, Y.; Seto, H.; Abe, M.; Shibuya, A. ISIJ Int. 1993, 33, 1029. (5) Uchida, J.; Tsuda, T.; Yamamoto, Y.; Seto, H.; Abe, M.; Shibuya, A. ISIJ Int. 1993, 33, 1029.
6. [6]
  (6) Moffat, T. P. J. Electrochem. Soc. 1994, 141, 3059. (6) Moffat, T. P. J. Electrochem. Soc. 1994, 141, 3059.
7. [7]
  (7) Stafford, G. R.; Haarberg, G. M. Plasmas & Ions 1999, 2, 35. (7) Stafford, G. R.; Haarberg, G. M. Plasmas & Ions 1999, 2, 35.
8. [8]
  (8) Stafford, G. R. J. Electrochem. Soc. 1994, 141, 945. (8) Stafford, G. R. J. Electrochem. Soc. 1994, 141, 945.
9. [9]
  (9) Ueda, M.; Kigawa, H.; Ohtsuka, T. Electrochim. Acta 2007, 52, 2515. (9) Ueda, M.; Kigawa, H.; Ohtsuka, T. Electrochim. Acta 2007, 52, 2515.
10. [10]
  (10) Zhu, Q.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 2001, 148, C88.(10) Zhu, Q.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 2001, 148, C88.
11. [11]
  (11) Carlin, R. T.; Trulove, P. C.; DeLong, H. C. J. Electrochem. Soc. 1996, 143, 2747. (11) Carlin, R. T.; Trulove, P. C.; DeLong, H. C. J. Electrochem. Soc. 1996, 143, 2747.
12. [12]
  (12) Zell, C. A.; Freyland,W. Langmuir 2003, 19, 7445. (12) Zell, C. A.; Freyland,W. Langmuir 2003, 19, 7445.
13. [13]
  (13) Mitchell, J. A.; Pitner,W. R.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 1996, 143, 3448. (13) Mitchell, J. A.; Pitner,W. R.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 1996, 143, 3448.
14. [14]
  (14) Ali, M. R.; Nishikata, A.; Tsuru, T. Electrochim. Acta 1997, 42, 1819. (14) Ali, M. R.; Nishikata, A.; Tsuru, T. Electrochim. Acta 1997, 42, 1819.
15. [15]
  (15) Ali, M. R.; Nishikata, A.; Tsuru, T. Electrochim. Acta 1997, 42, 2347. (15) Ali, M. R.; Nishikata, A.; Tsuru, T. Electrochim. Acta 1997, 42, 2347.
16. [16]
  (16) Tierney, B. J.; Pitner,W. R.; Mitchell, J. A.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 1998, 145, 3110. (16) Tierney, B. J.; Pitner,W. R.; Mitchell, J. A.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 1998, 145, 3110.
17. [17]
  (17) Zhu, Q.; Hussey, C. L. J. Electrochem. Soc. 2001, 148, C395.(17) Zhu, Q.; Hussey, C. L. J. Electrochem. Soc. 2001, 148, C395.
18. [18]
  (18) Tsuda, T.; Nohira, T.; Ito, Y. Electrochim. Acta 2002, 47, 2817. (18) Tsuda, T.; Nohira, T.; Ito, Y. Electrochim. Acta 2002, 47, 2817.
19. [19]
  (19) Tsuda, T.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 2004, 151, C379.(19) Tsuda, T.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 2004, 151, C379.
20. [20]
  (20) De Long, H. C.; Mitchell, J. A.; Trulove, P. C. High Temp. Mater. Processes (New York) 1998, 2, 507.(20) De Long, H. C.; Mitchell, J. A.; Trulove, P. C. High Temp. Mater. Processes (New York) 1998, 2, 507.
21. [21]
  (21) Aravinda, C. L.; Mukhopadhyay, I.; Freyland,W. Phys. Chem. Chem. Phys. 2004, 6, 5225.(21) Aravinda, C. L.; Mukhopadhyay, I.; Freyland,W. Phys. Chem. Chem. Phys. 2004, 6, 5225.
22. [22]
  (22) Pradhan, D.; Reddy, R.; Lahiri, A. Metall. Mater. Trans. B 2009, 40, 114. (22) Pradhan, D.; Reddy, R.; Lahiri, A. Metall. Mater. Trans. B 2009, 40, 114.
23. [23]
  (23) Tsuda, T.; Hussey, C. L.; Stafford, G. R.; Kongstein, O. J. Electrochem. Soc. 2004, 151, C447.(23) Tsuda, T.; Hussey, C. L.; Stafford, G. R.; Kongstein, O. J. Electrochem. Soc. 2004, 151, C447.
24. [24]
  (24) Tsuda, T.; Arimoto, S.; Kuwabata, S.; Hussey, C. L. J. Electrochem. Soc. 2008, 155, D256.(24) Tsuda, T.; Arimoto, S.; Kuwabata, S.; Hussey, C. L. J. Electrochem. Soc. 2008, 155, D256.
25. [25]
  (25) Tsuda, T.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 2005, 152, C620.(25) Tsuda, T.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 2005, 152, C620.
26. [26]
  (26) Gao, L. X.;Wang, L. N.; Qi, T.; Li, Y. P.; Chu, J. L.; Qu, J. K. Acta Physico-Chimica Sinica 2008, 24, 939. [高丽霞, 王丽娜, 齐涛, 李玉平, 初景龙, 曲景奎. 物理化学学报, 2008, 24, 939.] (26) Gao, L. X.;Wang, L. N.; Qi, T.; Li, Y. P.; Chu, J. L.; Qu, J. K. Acta Physico-Chimica Sinica 2008, 24, 939. [高丽霞, 王丽娜, 齐涛, 李玉平, 初景龙, 曲景奎. 物理化学学报, 2008, 24, 939.]
27. [27]
  (27) Gale, R. J.; Gilbert, B.; Osteryoung, R. A. Inorg. Chem. 1979, 18, 2723. (27) Gale, R. J.; Gilbert, B.; Osteryoung, R. A. Inorg. Chem. 1979, 18, 2723.
28. [28]
  (28) Lee, J. J.; Miller, B.; Shi, X.; Kalish, R.; Wheeler, K. A. J. Electrochem. Soc. 2000, 147, 3370. (28) Lee, J. J.; Miller, B.; Shi, X.; Kalish, R.; Wheeler, K. A. J. Electrochem. Soc. 2000, 147, 3370.
29. [29]
  (29) Ali, M. R.; Nishikata, A.; Tsuru, T. J. Electroanal. Chem. 2001, 513, 111. (29) Ali, M. R.; Nishikata, A.; Tsuru, T. J. Electroanal. Chem. 2001, 513, 111.
30. [30]
  (30) u, S. P.; Sun, I.W. Electrochim. Acta 2008, 53, 2538. (30) u, S. P.; Sun, I.W. Electrochim. Acta 2008, 53, 2538.
31. [31]
  (31) Pitner,W. R.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 1996, 143, 130. (31) Pitner,W. R.; Hussey, C. L.; Stafford, G. R. J. Electrochem. Soc. 1996, 143, 130.
32. [32]
  (32) Deng, M. J.; Sun, I.W.; Chen, P. Y.; Chang, J. K.; Tsai,W. T. Electrochim. Acta 2008, 53, 5812. (32) Deng, M. J.; Sun, I.W.; Chen, P. Y.; Chang, J. K.; Tsai,W. T. Electrochim. Acta 2008, 53, 5812.
33. [33]
  (33) Mann, O.; Freyland,W. J. Phys. Chem. C 2007, 111, 9832. (33) Mann, O.; Freyland,W. J. Phys. Chem. C 2007, 111, 9832.
34. [34]
  (34) Kaufman, L. CALPHAD; Pergamon Press: New York, 1977; Vol. 1, pp 1-89.(34) Kaufman, L. CALPHAD; Pergamon Press: New York, 1977; Vol. 1, pp 1-89.
35. [35]
  (35) Lupis, C. H. P. Chemical Thermodynamics of Materials, North- Holland: New York, 1983; p 581.(35) Lupis, C. H. P. Chemical Thermodynamics of Materials, North- Holland: New York, 1983; p 581.
36. [36]
  (36) Shi, L. Alloy Thermodynamics, 1st ed.; China Machine Press: Beijing, 1992; pp 285-348. [石霖. 合金热力学, 第一版; 北京: 机械工业出版社, 1992: 285-348.](36) Shi, L. Alloy Thermodynamics, 1st ed.; China Machine Press: Beijing, 1992; pp 285-348. [石霖. 合金热力学, 第一版; 北京: 机械工业出版社, 1992: 285-348.]
37. [37]
  (37) Ye, D. L. Handbook of Thermodynamic Data for Applied Inorganic Material, 2nd ed.; Metallurgical Industry Press: Beijing, 2002; pp 43-46, 270-272. [叶大伦. 实用无机物热力学数据手册, 第二版; 北京: 冶金工业出版社, 2002: 43-46, 270-272.](37) Ye, D. L. Handbook of Thermodynamic Data for Applied Inorganic Material, 2nd ed.; Metallurgical Industry Press: Beijing, 2002; pp 43-46, 270-272. [叶大伦. 实用无机物热力学数据手册, 第二版; 北京: 冶金工业出版社, 2002: 43-46, 270-272.]

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沈阳化工大学材料科学与工程学院沈阳 110142

从2AlCl₃/Et₃NHCl离子液体中电沉积制备Ni 和Ni-Al 合金

English

Preparation of Ni and Ni-Al Alloys from 2AlCl₃/Et₃NHCl Ionic Liquid by Electrodeposition

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中国化学会秘书处

从2AlCl3/Et3NHCl离子液体中电沉积制备Ni 和Ni-Al 合金

English

Preparation of Ni and Ni-Al Alloys from 2AlCl3/Et3NHCl Ionic Liquid by Electrodeposition

CCS Chemistry：嵌段共聚物自组装成 “三明治”二维有机材料，实现纳米级压力传感功能

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CCS Chemistry：工作高效不疲劳，只须让催化剂动起来

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CCS Chemistry：金黄色葡萄球菌醛基脱氢酶是如何识别特异性底物的？

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通讯作者: 陈斌, bchen63@163.com

中国化学会秘书处

从2AlCl₃/Et₃NHCl离子液体中电沉积制备Ni 和Ni-Al 合金

Preparation of Ni and Ni-Al Alloys from 2AlCl₃/Et₃NHCl Ionic Liquid by Electrodeposition

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