引用本文:
张国栋. Ni-P化学镀反应速率及机理研究[J]. 物理化学学报,
1998, 14(05): 429-434.
doi:
10.3866/PKU.WHXB19980509
Citation: Zhang Guo-Dong. Study on the Reaction Rate and Mechanism of Ni-P Electroless Plating[J]. Acta Physico-Chimica Sinica, 1998, 14(05): 429-434. doi: 10.3866/PKU.WHXB19980509
Citation: Zhang Guo-Dong. Study on the Reaction Rate and Mechanism of Ni-P Electroless Plating[J]. Acta Physico-Chimica Sinica, 1998, 14(05): 429-434. doi: 10.3866/PKU.WHXB19980509
Ni-P化学镀反应速率及机理研究
English
Study on the Reaction Rate and Mechanism of Ni-P Electroless Plating
Abstract:
The deposition rate of Ni-P electroless coating and the decomposition rate of H2PO, were studied by analyzing the mass and the P content of the electeroless coating, and by measuring the volume of the evolved hydrogen. Based on the mixed potential theory, electroless plating current, which can be expressed by the reaction rate, was obtained by analyzing the polarzation curves of Ni-P in solutions of various composition. The reaction is consistant with the one electron transfer mechanism. The influnce of the solution pH on electeoless plating rate and electroless plating effeciency was explained.
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Key words:
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Ni-P electroless plating
- / Mixed porential theory
- / Reaction mechanism
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